Characterisation of tin-copper intermetallic growth in electrodeposited tin coatings using electrochemical oxidation techniques (2014)

First Author: Stuttle C
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1179/0020296714z.000000000174

Publication URI: http://dx.doi.org/10.1179/0020296714z.000000000174

Type: Journal Article/Review

Parent Publication: Transactions of the IMF

Issue: 5

ISSN: 0020-2967