An Investigation Into the Role of Lead as a Suppressant for Tin Whisker Growth in Electronics (2014)

First Author: Wang J
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2014.2302802

Publication URI: http://dx.doi.org/10.1109/tcpmt.2014.2302802

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 4

ISSN: 2156-3950