Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates (2014)

First Author: Ashworth M
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1179/0020296713z.000000000116

Publication URI: http://dx.doi.org/10.1179/0020296713z.000000000116

Type: Journal Article/Review

Parent Publication: Transactions of the IMF

Issue: 5

ISSN: 0020-2967