Statistical analysis of stencil technology for wafer-level bumping (2014)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1108/ssmt-07-2013-0017
Publication URI: http://dx.doi.org/10.1108/ssmt-07-2013-0017
Type: Journal Article/Review
Parent Publication: Soldering & Surface Mount Technology
Issue: 2
ISSN: 0954-0911