Improved Electroless Copper Coverage at Low Catalyst Concentrations and Reduced Plating Temperatures enabled by Low Frequency Ultrasound (2014)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Type: Journal Article/Review
Volume: 9
Parent Publication: INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE
Issue: 12
ISSN: 1452-3981