Vacuum Packaged Low-Power Resonant MEMS Strain Sensor (2016)
Attributed to:
Innovation and Knowledge Centre for Smart Infrastructure and Construction - Collaborative Programme Tranche 1
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/jmems.2016.2587867
Publication URI: http://dx.doi.org/10.1109/jmems.2016.2587867
Type: Journal Article/Review
Parent Publication: Journal of Microelectromechanical Systems
Issue: 5