Vacuum Packaged Low-Power Resonant MEMS Strain Sensor (2016)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/JMEMS.2016.2587867

Publication URI: http://dx.doi.org/10.1109/JMEMS.2016.2587867

Type: Journal Article/Review

Parent Publication: Journal of Microelectromechanical Systems

Issue: 5