Low Stress Cycle Effect in IGBT Power Module Die-Attach Lifetime Modeling (2016)

First Author: Lai W
Attributed to:  Underpinning Power Electronics 2012: Devices Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2015.2501540

Publication URI: http://dx.doi.org/10.1109/tpel.2015.2501540

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 9