Scanned Mask Imaging Solid State Laser Tool for Cost Effective Flip Chip - Chip Scale Package Manufacture (2015)

First Author: Myles D
Attributed to:  EPSRC Centre for Innovative Manufacturing in Laser-based Production Processes funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.2961/jlmn.2015.01.0019

Publication URI: http://dx.doi.org/10.2961/jlmn.2015.01.0019

Type: Journal Article/Review

Parent Publication: Journal of Laser Micro/Nanoengineering

Issue: 1