Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K (2016)

First Author: Agyakwa P

Attributed to: University of Nottingham - Equipment Account funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-016-4519-0

Publication URI: http://dx.doi.org/10.1007/s11664-016-4519-0

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 7