A thermal cycling reliability study of ultrasonically bonded copper wires (2016)

First Author: Arjmand E

Attributed to: University of Nottingham - Equipment Account funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2016.01.009

Publication URI: http://dx.doi.org/10.1016/j.microrel.2016.01.009

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability