Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior (2017)

First Author: Li J

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/TCPMT.2017.2683202

Publication URI: http://dx.doi.org/10.1109/TCPMT.2017.2683202

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 5