Impact of temperature imbalance on junction temperature identification for multiple chip modules using TSEPs (2017)

First Author: Gonzalez J.O.

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/sbmicro.2017.7990732

Publication URI: http://dx.doi.org/10.1109/sbmicro.2017.7990732

Type: Other

Parent Publication: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management