Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints (2018)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2018.03.013
Publication URI: http://dx.doi.org/10.1016/j.microrel.2018.03.013
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability