Reactive material jetting of polyimide insulators for complex circuit board design (2019)
Attributed to:
Enabling Next Generation Additive Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.addma.2018.11.017
Publication URI: http://dx.doi.org/10.1016/j.addma.2018.11.017
Type: Journal Article/Review
Parent Publication: Additive Manufacturing