Reactive material jetting of polyimide insulators for complex circuit board design (2019)

First Author: Zhang F
Attributed to:  Enabling Next Generation Additive Manufacturing funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.addma.2018.11.017

Publication URI: http://dx.doi.org/10.1016/j.addma.2018.11.017

Type: Journal Article/Review

Parent Publication: Additive Manufacturing