Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints (2018)
Attributed to:
Engineering Fellowships for Growth: Solidification Processing of Alloys for Sustainable Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s10854-018-0302-8
Publication URI: http://dx.doi.org/10.1007/s10854-018-0302-8
Type: Journal Article/Review
Parent Publication: Journal of Materials Science: Materials in Electronics
Issue: 1