An automated process for inclusion of package dies and circuitry within a textile yarn (2018)
Attributed to:
Novel manufacturing methods for functional electronic textiles
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/dtip.2018.8394189
Publication URI: http://dx.doi.org/10.1109/dtip.2018.8394189
Type: Conference/Paper/Proceeding/Abstract