Power cycling reliability of time-reduced sintering for attaching SiC diodes using nanosilver film (2018)

First Author: Dai J

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://ieeexplore.ieee.org/abstract/document/8403178

Type: Conference/Paper/Proceeding/Abstract