Growth of ß intermetallic in an Al-Cu-Si alloy during directional solidification via machine learned 4D quantification (2019)

First Author: B. Cai
Attributed to:  Disruptive Solidification Microstructures via Thermoelectric Control funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: http://www.elsevier.com/locate/scriptamat

Type: Journal Article/Review

Volume: 165

Parent Publication: Scripra Materialia