Interaction effects between the preferred growth of ß-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling (2018)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546386
Publication URI: http://dx.doi.org/10.1109/estc.2018.8546386
Type: Conference/Paper/Proceeding/Abstract