Three-dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules (2019)
Attributed to:
Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1111/jmi.12803
PubMed Identifier: 31070241
Publication URI: http://europepmc.org/abstract/MED/31070241
Type: Journal Article/Review
Parent Publication: Journal of Microscopy
Issue: 3
ISSN: 0022-2720