Band Offset Models of Three-Dimensionally Bonded Semiconductors and Insulators (2019)
Attributed to:
Integration of Novel Materials in Spintronic Devices
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1021/acs.jpcc.9b00152
Publication URI: http://dx.doi.org/10.1021/acs.jpcc.9b00152
Type: Journal Article/Review
Parent Publication: The Journal of Physical Chemistry C
Issue: 9