Thermal transport in model copper-polyethylene interfaces. (2019)

First Author: Ren Y
Attributed to:  Advances Polymer material for Energy Security - POLYMAT funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1063/1.5123616

PubMed Identifier: 31703489

Publication URI: http://europepmc.org/abstract/MED/31703489

Type: Journal Article/Review

Volume: 151

Parent Publication: The Journal of chemical physics

Issue: 17

ISSN: 0021-9606