Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy (2018)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/estc.2018.8546440
Publication URI: http://dx.doi.org/10.1109/estc.2018.8546440
Type: Conference/Paper/Proceeding/Abstract