Further Enhancement of Thermal Conductivity through Optimal Uses of h-BN Fillers in Polymer-Based Thermal Interface Material for Power Electronics (2019)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/ectc.2019.00241
Publication URI: http://dx.doi.org/10.1109/ectc.2019.00241
Type: Conference/Paper/Proceeding/Abstract