Strain Enhanced Functionality in a Bottom-Up Approach Enabled 3D Super-Nanocomposites (2019)

First Author: Chen A

Attributed to: Precision Manufacturing of Flexible CMOS funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/adfm.201900442

Publication URI: http://dx.doi.org/10.1002/adfm.201900442

Type: Journal Article/Review

Parent Publication: Advanced Functional Materials

Issue: 26