In-line evanescent-field-coupled THz bandpass mux/demux fabricated by additive layer manufacturing technology (2020)

First Author: Hernandez-Serrano A

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1364/osac.399389

Publication URI: http://dx.doi.org/10.1364/osac.399389

Type: Journal Article/Review

Parent Publication: OSA Continuum

Issue: 9