Tooling and procedures for hybrid integration of lasers by flip-chip technology (2020)

First Author: Mitchell C

Attributed to: Silicon Photonics for Future Systems funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc48849.2020.9229661

Publication URI: http://dx.doi.org/10.1109/estc48849.2020.9229661

Type: Conference/Paper/Proceeding/Abstract