Direct Epitaxial Approach to Achieve a Monolithic On-Chip Integration of a HEMT and a Single Micro-LED with a High-Modulation Bandwidth. (2021)

First Author: Cai Y
Attributed to:  Future Compound Semiconductor Manufacturing Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1021/acsaelm.0c00985

PubMed Identifier: 33615233

Publication URI: http://europepmc.org/abstract/MED/33615233

Type: Journal Article/Review

Volume: 3

Parent Publication: ACS applied electronic materials

Issue: 1

ISSN: 2637-6113