Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix (2018)

First Author: Bournias-Varotsis A
Attributed to:  Embedded Integrated Intelligent Systems for Manufacturing funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jmapro.2018.03.027

Publication URI: http://dx.doi.org/10.1016/j.jmapro.2018.03.027

Type: Journal Article/Review

Parent Publication: Journal of Manufacturing Processes