NUMERICAL SIMULATION OF HEAT TRANSFER ENHANCEMENT FOR COPPER FOAM HEAT SINK IN ELECTRONIC DEVICES USING WATER BASED BN NANOFLUIDS (2018)

First Author: Zhang G

Attributed to: Imperial College London - Equipment Account funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1615/ihtc16.ctm.023451

Publication URI: http://dx.doi.org/10.1615/ihtc16.ctm.023451

Type: Conference/Paper/Proceeding/Abstract