Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics (2019)

First Author: Bournias-Varotsis A
Attributed to:  Embedded Integrated Intelligent Systems for Manufacturing funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.addma.2019.100799

Publication URI: http://dx.doi.org/10.1016/j.addma.2019.100799

Type: Journal Article/Review

Parent Publication: Additive Manufacturing