Cu-Cu Bonding with Cu Nanowire Arrays for Electronics Integration (2020)

First Author: Jiang H
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc48849.2020.9229670

Publication URI: http://dx.doi.org/10.1109/estc48849.2020.9229670

Type: Conference/Paper/Proceeding/Abstract