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H-Cu vacancy co-segregation and H diffusion in Cu grain boundaries (2026)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2026.114776

Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2026.114776

Type: Journal Article/Review

Parent Publication: Materials Today Communications