H-Cu vacancy co-segregation and H diffusion in Cu grain boundaries (2026)
Attributed to:
Structural dynamics of amorphous functional oxides - the role of morphology and electrical stress
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2026.114776
Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2026.114776
Type: Journal Article/Review
Parent Publication: Materials Today Communications