Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling (2011)

First Author: Agyakwa P
Attributed to:  Technologies for SiC electronics and sensors in extreme environments funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2010.08.018

Publication URI: http://dx.doi.org/10.1016/j.microrel.2010.08.018

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 2