A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects (2011)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2011.07.052

Publication URI: http://dx.doi.org/10.1016/j.microrel.2011.07.052

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 9-11