Towards an inductively coupled power/data link for bondpad-less silicon chips (2011)

First Author: Luan S
Attributed to:  Ultra Low Power Implantable Platform for Next Generation Neural Interfaces funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/iscas.2011.5938136

Publication URI: http://dx.doi.org/10.1109/iscas.2011.5938136

Type: Conference/Paper/Proceeding/Abstract

ISBN: 978-1-4244-9473-6