Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise (2011)

First Author: Xiang D

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/TIA.2011.2168556

Publication URI: http://dx.doi.org/10.1109/TIA.2011.2168556

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Industry Applications

Issue: 6