Laser Prototyping of Microwave Circuits in LTCC Technology (2009)
Attributed to:
Integrated Functional Materials for System-in-Package Applications
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tmtt.2009.2033846
Publication URI: http://dx.doi.org/10.1109/tmtt.2009.2033846
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Microwave Theory and Techniques
Issue: 12