Power Electronics Modules by Rapid Moulding: PE2M

Project PE2M is about producing power electronics modules containing silicon carbide semiconductors by packaging using novel encapsulants. The use of rapidly mouldable encapsulants to package SiC devices enables several key innovations. They can be filled with other materials to enhance thermal conductivity without compromising electrical resistivity; they can be removed with environmentally acceptable solvents at end of life to enable disassembly recycling of valuable materials; they provide a high integrity structure for the module including for high temperature operation; they can encapsulate modules very rapidly to enable high volume cost effective production.

In project PE2M, a new supply chain will be assembled to demonstrate the benefits of the encapsulation technology and the opportunities which this approach creates for suppliers, and users in aerospace.

The project group includes high volume supply chain companies specialising in interconnect and moulding, SME technology providers who have developed the innovative technologies in previous projects, the DER industrialisation centre at Warwick University, and an aerospace system producer.