(PITCH) advanced PackagIng Test probe Card laser microHoles

More-than-Moore's law increasingly drives advanced packaging technologies and probecard testing developments for semiconductor wafer-level testing. Sophisticated custom-made probecards for each IC design are used to establish Known-Good-Die before packaging and hence critical .

PITCH will develop ultra-high precision laser drilling for next generation (affordable) fine-pitch probecards urgently required by node size reduction below 5nm.