Manufacturing Advanced Coatings for Future Electronic Systems (MACFEST)

Electronics systems require the reliable attachment of large numbers of components on a printed circuit board. This is achieved using advanced soldering techniques to connect components to each other and to enable the device to function according to its design. Therefore, the quality and reliability of the solder joints is extremely important. Demands for increased electronic performance and reduced size have resulted in less area being available to connect components to the circuit board, so producing reliable joints has become a challenge. To achieve good solder joint reliability, a solderable coating is used on the circuit board, which also influences joint reliability. A new solderable coating, the subject of this project, uses nickel, palladium and gold (ENEPIG) based on the use of novel ionic liquids, which enable metal coatings to be deposited with markedly improved properties thereby ensuring long term electronic systems reliability, especially for those products used in harsh and challenging environments. The project will thus produce a new solderable coating that provides enhanced reliability and functionality to a wide range of electronic products, including several addressed in this call.