(LAND) Laser drilling guideplAtes for semicoNDuctor wafer test

LAND will develop ultra-high precision laser drilling in ceramic components for next generation devices. High hole count ceramic plates are required with more than 60,000 laser drilled holes per plate with several plates needed per final device. Oxford Lasers (OL) has been a world-leading supplier of the ceramic drilling technology since 2001 and plays a critically important role in major industrial supply chains.

Each year devices get smaller and the technical challenge is to drill ever smaller holes on ever tighter pitches. The project will develop new hardware prototypes and advanced laser drilling recipes to progress current state of art and demonstrate reduced hole size, increased aspect ratio and faster production rates. The project will lift developments from TRL level 3 to 6\.

Oxford Lasers will build on existing expertise in this field and deploy our R&D team and dedicated hardware to the project building on 29 years laser drilling experience. We expect this project to enable Oxford Lasers to continue its dominant presence in critical, rapidly growing export markets and increase market share as mechanical drilling is fast dwindling as a competing solution.

Keywords: ceramic laser drilling, semiconductor wafer test, Probecard