Advanced LED module manufacture, Litecool

Litecool
was formed in 2012 to develop and patent innovations for Light Emitting Diode
(LED) assemblies that offer significant performance benefits to rapidly growing markets.
Litecool has developed a unique set of core technologies that enable the packaging of any
LED chips to achieve up to 100% improvement in performance over leading products, by
enabling heat to more easily escape from the LED allowing it to run cooler, shine brighter,
and last longer. Litecool can achieve this and also produce the LED modules at competitive
cost compared with market leaders. Furthermore, the core technologies can be embodied into
a module which can be designed to fit in standard LED-based lighting systems and reduce the
size of heat-sinks or the need for active cooling. In this way lighting manufacturers can simply
‘plug-n-play’ with no need for design changes, access a broader range of applications, and
accelerate the lighting industry’s conversion to LEDs.
Litecool have completed a proof-of-market project and have identified key application areas
where their core technologies will have a significant impact. Litecool have also completed a
proof-of-concept project for down-lighting and industrial high-bay applications where they
have proven their core concepts which are now being launched as products. While great
advances were achieved in light output and energy efficiency, the use of conventional
materials and assembly methods used in LED module assembly significantly inhibits further
performance gains and cost reduction. This has motivated Litecool to develop progressive
concepts in module design and TSB funding is required to develop, combine and refine
advanced micro-manufacturing methods to realise the next generation products which are
capable of achieving higher levels of performance than previously possible, and enable
greater lighting emission, heat dissipation, electrical isolation, and flexibility in design for
optical performance at industrial scales of manufacture.