DURABLE HIGH TEMPERATURE ELECTRONICS PACKAGING FOR DOWN-WELL APPLICATIONS
Lead Research Organisation:
University of Oxford
Department Name: Materials
Abstract
This proposal addresses the issue of high temperature electronics packaging technology for down-well logging in the oil and gas industries, where there is a need to continously monitor the reservoir potential and environment to maximise recovery of reserves. Currently there are temperature and time restrictions on the exposure of electronics systems within the down-well logging application. This proposal aims to extend the high temperature electronics packaging capability to up to 250 oC for a lifetime of up to 10 years. This will be achieved through novel substrate and interconnection technologies that will optimise thermal management, mechanical robustness and are suited to high temperature environments. Advanced modelling/accelerated life tests and failure analysis will be used to yield accurate life predictions within the down-well logging environment. Spin-off benefits will also apply to the aerospace industry.
Organisations
Publications
| Description | The "Durable high temperature electronics packaging for down-well applications"project focused on a reliable die attach and interconnect system: Solders and adhesives that can survive 2000 hours at 250oC have been identified, which can be used for the attachment of devices and passive components. Reliable wire bond interconnections using gold wire have been demonstrated on ceramic packages and substrates. A high temperature conductive adhesive developed by GEM one of the industrial partners has been characterised for component attach. This adhesive can be loaded with different conductive filler materials that are compatible with typical metallisation finishes on components These advances in high temperature packaging materials and processes have been demonstrated by GE Aviation on circuits, representative of those required for signal conditioning and processing of analogue outputs from sensors to convert the signal to digital data, where the control electronics is co-located with the sensor element in the hot environment. This co-location of sensors and control electronics can reduce the noise and interference of the signals and also reduce the need for special cooling requirements around the system. |
| Exploitation Route | The major output is industrial exploitation. This was a TSB Industrial led project where the Department of Materials, Oxford University were providing key materials knowledge input and developing physics of failure and reliability prediction models to assess certain aspects of the electronic packaging. In the challenge to extend the operation of electronics in hostile environments such as down-well drilling, geothermal exploration and aero-engines, materials and assembly techniques that can withstand 250oC for prolonged durations have been developed through the "Durable high temperature electronics packaging for down-well applications" project. There is a growing desire to install electronic power and control systems in high temperature environments to improve the accuracy of critical measurements and reduce the cost of cabling from remote and hostile locations. Typical applications include down-well drilling for petroleum/gas and geothermal exploration and turbine engines for aircraft propulsion and power generation, which need the electronics to operate at 200oC and above. The traditional higher temperature limit for electronics is 125oC, which means that different semiconductors and assembly techniques are needed to operate in these environments. Robust packaging and reliable interconnections are the keys to achieving long-life electronics for high temperature environments. The fundamental change in the packaging approach to extend the high temperature performance of electronics is to switch from the traditional soldered surface mount or through-hole plastic packaged devices assembled onto FR4 printed circuit board materials to semiconductor devices mounted onto ceramic or insulated metal substrate based packages that are more capable of withstanding the higher temperatures. The lead partner GE Aviation Systems has secured follow on funding from EU Cleanskies to implement a high temperature electronics sensor module for helicopter engines using the knowledge gained in UPTEMP. Oxford University is also a partner in this project supplying critical materials knowledge and failure and reliability testing. Exploitation will follow a direct path from materials through the supply chain to final users in the aerospace sector and later oil&gas and geothermal energy sectors. |
| Sectors | Aerospace, Defence and Marine,Electronics,Energy,Environment,Transport |
| URL | http://www.materials.ox.ac.uk/peoplepages/johnston.html |
| Description | EU |
| Amount | £170,000 (GBP) |
| Funding ID | 255749 |
| Organisation | European Commission |
| Sector | Public |
| Country | European Union (EU) |
| Start | 01/2010 |
| End | 07/2013 |
| Description | EU |
| Amount | £170,000 (GBP) |
| Funding ID | 255749 |
| Organisation | European Commission |
| Sector | Public |
| Country | European Union (EU) |
| Start | 01/2010 |
| End | 07/2013 |