Integrated Functional Materials for System-in-Package Applications

Lead Research Organisation: Imperial College London
Department Name: Electrical and Electronic Engineering

Abstract

Integrated electronics technology continues to advance across an ever wider range of frequencies, at ever greater circuit densities. Increasingly research and development is being directed at supplementing the capabilities of monolithic silicon circuits with additional functional and structural materials, closely integrated using system-in-package (SiP) technology. This approach plays well to UK strengths, where the capability in advanced materials such as technical ceramics and polymers, and in alternative micro-structures such as MEMS devices, is very strong. This proposal brings together three leading groups in the areas of microfabrication and MEMS (Imperial), advanced thin film materials (Cranfield and Leeds), and radio frequency applications (Leeds), creating a consortium ideally placed to advance the SiP field. The project will develop enabling technologies for this industry trend through work on three themes:i. integration of functional ceramic films into electrical and RF components, for enhanced performance or new functionality;ii. development of novel functional ceramic films, including lead-free electro-ceramics for reduced environmental impact;iii. integration of material combinations traditionally seen as incompatible because of material mis-match or processing incompatibility, and technologies for building circuits on new low-cost substrates. For each theme, the work will be organised within a separate workpackage. Components which will be developed include variable capacitors, transmission lines and filters; and sensors based on thin-film bulk acoustic resonators. Research on materials will focus on microwave dielectrics and ferrites. The integration work will include several methods for the transfer of ceramic films from high temperature- to polymeric- substrates, and bonding techniques for such substrates. A fourth workpackage will target an overall systems demonstrator to integrate the results of the separate themes.The project will build on developments in the two Exploratory projects currently being undertaken by the proposers: on processes for Laser-Lift-Off and bonding (Leeds), and on integration of advanced ceramic films in MEMS 3D structures and devices (Cranfield and Imperial).

Publications

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Bansal A (2011) Laser transfer of sol-gel ferroelectric thin films using an ITO release layer in Microelectronic Engineering

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Dou G (2011) Transfer of functional ceramic thin films using a thermal release process. in Advanced materials (Deerfield Beach, Fla.)

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Pu S (2013) Stress in electroplated gold on silicon substrates and its dependence on cathode agitation in Microelectronic Engineering

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Pu S (2016) RF MEMS Zipping Varactor With High Quality Factor and Very Large Tuning Range in IEEE Electron Device Letters

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Pu S (2010) Stable zipping RF MEMS varactors in Journal of Micromechanics and Microengineering

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Pu S H (2007) Design and Simulation of Zipping Variable Capacitors

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Suan Hui Pu (2008) High-Q continuously tunable zipping varactors with large tuning range

 
Description The project led to follow-on support in 3D Electrical MEMS, Energy Harvesting electronics, and advanced microelectronic packaging. Our further work on integration of functional materials (piezoelectrics) in energy harvesters has led to devices currently being evaluated by several watch manufacturers. The project work on MEMS RF varactors contributed to the growing commercialization of this field, which is finally starting to reach mass market applications, particularly in the 4G smart phone.
First Year Of Impact 2013
Sector Electronics
Impact Types Economic
 
Company Name Microsaic Systems plc 
Description Microsaic Systems plc is a high technology company developing and marketing next generation mass spectrometry (MS) instruments for the analysis of gaseous, liquid and solid samples - providing solutions to enhance workflow and productivity. Microsaic has successfully miniaturised mass spectrometry by integrating the key MS components onto patented chip technologies called ionchip®, spraychip® and vac-chip™. Microsaic's MS products retain the performance of larger, conventional MS systems but are substantially smaller, lighter, consume less energy and have lower running costs. The Company's first product, the Microsaic 3500 MiD®, was launched in January 2011 and the Company launched the Microsaic 4000 MiD®, the world's smallest MS system, in April 2013. MS is widely accepted as the 'gold standard' method for identifying individual chemicals in samples and is used routinely across multiple sectors, including government, energy, utilities, pharmaceutical, diagnostics and healthcare, environmental, food and drink, security and defence, and industrial chemicals. Microsaic partners with customers to deliver products incorporating its next generation MS and other MEMS based technologies. History Microsaic Systems plc was established in 2001 to develop miniaturised MS instruments based on Micro-Electro-Mechanical Systems (MEMS) originating at the highly regarded Optical and Semiconductor Devices Group at Imperial College London. Microsaic has subsequently established a large portfolio of patents, of which 49 are granted, and six registered trademarks. The Company has been based at headquarters in Woking, UK since September 2004 and was admitted to AIM, a market of the London Stock Exchange, in April 2011 (ticker: MSYS). 
Impact The Company launched the Microsaic 4000 MiD®, the world's smallest mass spectrometry system, in April 2013.
Website http://www.microsaic.com