Novel High Thermal Conductivity Substrates for GaN Electronics: Thermal Innovation

Lead Research Organisation: University of Bath
Department Name: Electronic and Electrical Engineering

Abstract

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Publications

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Description The mechanism by which crystalline III-Nitride thin films can be grown on polycrystalline diamond substrates (i.e. substrates that lack a long-range epitaxial relationship with the grown III-Nitride semiconductor) hase been identified. Specifically, a very thin SiC film (typically circa 1-15 nanometres thick) forms during the growth of ploycrystalline diamond films on crystalline silicon substrates. This layer is chemically inert to the processes used to remove the silocon starting substrate and contains sufficient structural information for the growth of crystalline III-Nitride layers to occur.
Exploitation Route 1. Develop the processes identified in the publication found at http://iopscience.iop.org/article/10.1088/1361-6463/aa60a0 to enable the groth of thicker GaN layer layers and thereby reduce the residual defect density to a level compatible with commercial power transistor and radio frequency/microwave frequency transistor manufacture.
2. Investigate if other, more controlled methods of "imprinting" a very thing film (circa 1 nanometre thickness or less) containing the necessary structural information for nucleating the growth of crystalline AlN onto the polycrystalline diamond can be developed.
Sectors Aerospace, Defence and Marine,Electronics,Energy,Transport

URL http://iopscience.iop.org/article/10.1088/1361-6463/aa60a0