High reliability Interconnects: New Methodologies for Lead-free Solders
Lead Research Organisation:
University of Greenwich
Department Name: Mathematical Sciences, FACH
Abstract
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Organisations
People |
ORCID iD |
| Chris Bailey (Principal Investigator) |
Publications
Xu Y
(2022)
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
in International Journal of Plasticity
| Description | Current findings is that microstructure of the solder does influence lifetime of teh joint and needs to be considered in model predictions. |
| Exploitation Route | The infuence of microstructure needs to be considered on subsequent reliability predictions. Publications are in preperation to explain this. But in summary, this requires metrology techniques combined with a multi-scale modelling approach. |
| Sectors | Aerospace, Defence and Marine,Electronics,Energy |
| Description | Heterogeneous Integration Roadmap |
| Geographic Reach | Multiple continents/international |
| Policy Influence Type | Contribution to a national consultation/review |
| URL | https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html |
| Description | Closed Loop Digitalised Data Analytics and Analysis Platform (DAAP) for Intelligent Design and Manufacturing of Power Electronic Modules |
| Amount | £321,060 (GBP) |
| Funding ID | EP/W006642/1 |
| Organisation | Engineering and Physical Sciences Research Council (EPSRC) |
| Sector | Public |
| Country | United Kingdom |
| Start | 01/2022 |
| End | 06/2024 |
| Description | Conference Keynote Presentation |
| Form Of Engagement Activity | Participation in an activity, workshop or similar |
| Part Of Official Scheme? | No |
| Geographic Reach | International |
| Primary Audience | Industry/Business |
| Results and Impact | Presented a Keynote presentation virtually to attendees throughout the USA. This detailed our work on reliability modelling of solder joints and mentioned our work in this EPSRC project. |
| Year(s) Of Engagement Activity | 2020 |
| URL | https://attend.ieee.org/repp/ |
| Description | Contributions to IEEE Heterogeneous Integration Roadmap |
| Form Of Engagement Activity | A formal working group, expert panel or dialogue |
| Part Of Official Scheme? | No |
| Geographic Reach | International |
| Primary Audience | Professional Practitioners |
| Results and Impact | Contributions towards the IEEE Heterogeneous Integration Roadmap for which I (Professor Chris Bailey) am leading on the chapter for Modelling and Simulation. |
| Year(s) Of Engagement Activity | 2018,2019,2020 |
| URL | https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html |