Circuit modelling for the design of metamaterials for microwave applications.
Lead Research Organisation:
Loughborough University
Department Name: Wolfson Sch of Mech, Elec & Manufac Eng
Abstract
With the exciting advent of 3D printing, this revolutionary new manufacturing technique allows for low cost, low waste and highly customizable form of manufacturing. This research aims to take full advantage of 3D printing by exploring true 3D metamaterial structures. Tom is researching into the equivalent circuit modelling of such 3D metamaterials with the aim of building a library of metamaterial structures. With this an equivalent circuit containing target parameters and ideal responses can be given to a software program to generate a corresponding real world metamaterial to enable rapid prototyping of microwave circuits. Theoretical/analytical modelling, computer simulations and experimental measurement will be used to derive equivalent metamaterial circuit models.
Organisations
Studentship Projects
| Project Reference | Relationship | Related To | Start | End | Student Name |
|---|---|---|---|---|---|
| EP/N509516/1 | 01/10/2016 | 30/09/2021 | |||
| 1851767 | Studentship | EP/N509516/1 | 01/01/2017 | 30/06/2020 | Tom Whittaker |
| Description | Investigation in 3D printed, metamaterial passive RF/microwave components and circuits was conducted. Designs for 3D printable metamaterial capacitors were produced which provided improved frequency stable characteristics compared with current commercial offerings. Furthermore, designs for 3D printable inductors were also investigated, though it was found that current magnetic metamaterials are unsuitable for the application of frequency stable inductor design as the vast majority of designs are resonant and thus narrowband. Finally, passive circuits with improved wider-band characteristics were produced demonstrating the improvements gained from deploying 3D printing techniques and metamaterials into RF/microwave circuit design. This work presents new research potential into 3D printed circuit substrates that incorporate different dielectrics and substrate thicknesses (3D heterogeneous substrates) to further tailor the electromagnetic properties and thus the circuit's characteristics. |
| Exploitation Route | Future potential research potential has been identified into the design of 3D heterogeneous substrates that incorporate multiple various dielectrics and various substrate thickness to further tailor the electromagnetic properties inside the circuit substrate. |
| Sectors | Aerospace, Defence and Marine,Digital/Communication/Information Technologies (including Software) |
| URL | https://www.symeta.co.uk/ |