Degradation of thermal interface materials for high-temperature power electronics applications (2013)

First Author: Skuriat R
Attributed to:  Power Electronics for Adverse High Temperature Environments (PEATE) funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2013.05.011

Publication URI: http://dx.doi.org/10.1016/j.microrel.2013.05.011

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 12