Microstructure and mechanical properties of physical vapor deposited Cu/W nanoscale multilayers: Influence of layer thickness and temperature (2014)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.tsf.2014.05.044
Publication URI: http://dx.doi.org/10.1016/j.tsf.2014.05.044
Type: Journal Article/Review
Parent Publication: Thin Solid Films